Field effect transister and process for producing the same

ABSTRACT

A field effect transistor has an MOS structure and is formed of a nitride based compound semiconductor. The field effect transistor includes a substrate; a semiconductor operating layer having a recess part and formed on the substrate; an insulating layer formed on the semiconductor operating layer including the recess part; a gate electrode formed on the insulating layer at the recess part; and a source electrode and a drain electrode formed on the semiconductor operating layer with the recess part in between and electrically connected to the semiconductor operating layer. The recess part includes a side wall protruding and inclined relative to the semiconductor operating layer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority from a Japanese patent application No. 2008-004950 filed on Jan. 11, 2008, the entire content of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a field effect transistor comprised of a nitride based compound to be used for a device for power electronics and a device of high frequency amplification, and to a process for producing the same.

2. Description of the Related Art

A wide band gap semiconductor representative of a III-V group nitride based compound is extremely attractive as a material for a semiconductor device for a high temperature, a large power, or for a high frequency, because of having a breakdown voltage as high, a electronic transport property as satisfactory, and a thermal conductivity as satisfactory. Moreover, regarding a field effect transistor (an FET) having an AlGaN/GaN hetero structure for example, a two dimensional electron gas is generated in an interface due to a piezoelectric effect. The two dimensional electron gas draws attention because of high electron mobility and carrier density. Further, a hetero-junction FET (an HFET) using the AlGaN/GaN hetero structure has a low resistance and a fast switching speed, so that it is possible to perform an operation at a high temperature environment. The features are suitable for an application of a power switching.

The ordinary AlGaN/GaN HFET is a device of a normally on type, in which an electric current flows in a case where a bias is not applied to a gate, and then an electric current is cut off by applying a negative electric potential to the gate therein. In the application of the power switching, for securing safety, it is preferable to use the device of the normally off type, in which an electric current does not flow in the case where a bias is not applied to a gate, and then an electric current flows by applying a positive electric potential to the gate.

In order to produce the device of normally off type, it is necessary to adopt an MOS structure. For example, patent document has disclosed a field effect transistor having the MOS structure (an MOSFET), wherein a carrier supplying layer comprised of AlGaN or the like is etched off at a gate, and an insulating layer is formed on an etched surface of a carrier drifting layer.

Patent document: International Patent Application Publication No. 2003/071607

In the field effect transistor disclosed in the patent document, a side wall of the carrier supplying layer thus etched off is formed approximately vertical to the etched surface of the carrier drifting layer. As a result, an electric field is converged at a corner part with right angle formed with the side wall of the carrier supplying layer and the etched surface of the carrier drifting layer between the gate and a drain, thereby decreasing a breakdown voltage.

SUMMARY OF THE INVENTION

The present invention is presented with regard to the above mentioned conventional problems, and an object is to provide a field effect transistor having a high breakdown voltage, and to provide a process for producing the field effect transistor.

For solving the problems and attaining the objects, according to the present invention, a field effect transistor is formed of a nitride based compound semiconductor. The field effect transistor includes a substrate; a semiconductor operating layer having a recess part and formed on the substrate; an insulating layer formed on the semiconductor operating layer including the recess part; a gate electrode formed on the insulating layer at the recess part; and a source electrode and a drain electrode formed on the semiconductor operating layer with the recess part in between and electrically connected to the semiconductor operating layer. The recess part includes a side wall protruding and inclined relative to the semiconductor operating layer.

According to the present invention, a process for producing a field effect transistor formed of a nitride based compound semiconductor includes the steps of: forming a semiconductor operating layer onto a substrate; forming a recess part having a side wall inclined relative to the semiconductor operating layer on the semiconductor operating layer; forming a source electrode and a drain electrode on the semiconductor operating layer with the recess part in between for electrically connecting to the semiconductor operating layer; forming an insulating layer on the semiconductor operating layer having the recess part; and forming a gate electrode on the insulating layer at the recess part.

In the present invention, it is possible to alleviate a localized convergence of an electric field between the gate and the drain, thereby obtaining the field effect transistor having a high breakdown voltage.

The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view showing an MOSFET according to a first embodiment;

FIGS. 2A to 2F are views showing one example of a process for producing the MOSFET shown in FIG. 1;

FIG. 3 is a chart showing an angle at a standing up, an on-resistance and a breakdown voltage of MOSFETs according to Example 1-1, 1-2 and Comparative example 1, respectively;

FIG. 4 is a cross sectional view showing an MOSFET according to a second embodiment;

FIG. 5 is a graph showing a relationship between an angle at a standing up and an on-resistance of an MOSFET shown in FIG. 9;

FIG. 6 is a cross sectional view showing an MOSFET according to a third embodiment;

FIG. 7 is a chart showing an angle at a standing up, an on-resistance and a breakdown voltage of MOSFETs according to Example 2-1, 2-2 and Comparative example 2, respectively;

FIG. 8 is a cross sectional view showing an MOSFET according to a fourth embodiment;

FIGS. 9A to 9D are views showing one example of a process for producing the MOSFET shown in FIG. 8; and

FIG. 10 is a chart showing an angle at a standing up, an on-resistance and a breakdown voltage regarding individual MOSFETs according to Example 3-1, 3-2 and Comparative example 3, respectively.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of a field effect transistor and of a process for producing the field effect transistor according to the present invention will be described in detail below with reference to the drawings. The present invention is not limited to the embodiments.

FIG. 1 is a cross sectional view showing exemplary an MOSFET according to a first embodiment of the present invention. In the MOSFET 100, there are formed an AlN layer 102, a buffer layer 103 formed by laminating alternately a GaN layer and an AlN layer, and a lower part semiconductor layer 104 comprised of p-GaN on a substrate 101 comprised of sapphire, SiC, Si, or the like. A semiconductor operating layer 105 is formed on the lower part semiconductor layer 104. Regarding the semiconductor operating layer 105, a carrier drifting layer 105 a, which is comprised of undope GaN, and a carrier supplying layer 105 b, which is comprised of n-AlGaN and has a band gap energy different from that of the carrier drifting layer 105 a, are laminated one by one. A recess part 105 c is formed by removing a part of the carrier drifting layer 105 a and of the carrier supplying layer 105 b to a depth reaching the lower part semiconductor layer 104. On the semiconductor operating layer 105, a source electrode 106 and a drain electrode 107 are formed and sandwich the recess part 105 c. A gate insulating layer 108, which is comprised of SiO₂ or the like, is formed over a top surface of the semiconductor operating layer 105 and a top surface 104 a of the lower part semiconductor layer 104 at an inside of the recess part 105 c. At the recess part 105 c, a gate electrode 109 is formed on the gate insulating layer 108.

The MOSFET 100 is operated as a normally off type. Due to a two dimensional electron gas generated at an interface of the carrier drifting layer 105 a to the carrier supplying layer 105 b, it becomes able to obtain a low on-resistance and a faster switching operation.

In the MOSFET 100, a side wall 105 d at a side of the drain electrode 107 of the recess part 105 c stands up with inclining at an angle of θ1 from the top surface 104 a of the lower part semiconductor layer 104. Accordingly, it is possible to alleviate a localized convergence of an electric field between the gate and the drain, as opposed to the conventional configuration where a side wall stands up vertically from a surface of a lower part semiconductor layer. As a result, it becomes able to obtain the MOSFET 100 having a high breakdown voltage.

In the MOSFET 100, the side wall 105 d is inclined, so that a thickness of the carrier supplying layer 105 b decreases gradually from a side of the drain electrode 107. Therefore, a density of the two dimensional electron gas to be generated at the carrier drifting layer 105 a decreases gradually corresponding to the decrease in the thickness of the carrier supplying layer 105 b. As a result, a reduced surface field (RESURF) region is formed directly under the gate electrode 109 for alleviating the local convergence of the electric field, thereby further improving the breakdown voltage.

When the angle θ1 is less than 90 degrees, it is able to relax the localized convergence of the electric field. It is preferable the angle θ1 is smaller than 75 degrees, and more preferably is not smaller than 65 degrees, because it is able to relax the localized convergence sufficiently. When the angle of θ1 is greater than 30 degrees, the on-resistance reduces, and a distance between the source and the drain becomes too long, thereby making it desirable to reduce a size for a device and a producing cost.

In the MOSFET 100, a side wall 105 e at a side of the source electrode 106 of the recess part 105 c stands up as well, with inclining at an angle θ2 from the top surface 104 a of the lower part semiconductor layer 104. The angle θ2 is similar to the angle θ1. However, regarding the side wall 105 e, the angle θ2 may be different from the angle θ1, and the side wall 105 e may stand up vertically from the top surface 104 a.

Next, a process for producing the MOSFET 100 will be described in detail below. FIGS. 2A to 2F are explanatory views explaining one example of the process for producing the MOSFET 100. In the following description, a metalorganic chemical vapor deposition (MOCVD) method is used, and the invention is not limited thereto.

First, as shown in FIG. 2A, the substrate 101 comprised of Si and having an (111) plane as a principal top surface plane is set to an MOCVD device. Next, using a hydrogen gas with a concentration of 100% as a carrier gas, trimethylgallium (TMGa), trimethylaluminum (TMAl) and NH₃ are introduced at a flow rate of 58 μmol/min, 100 μmol/min and 12 l/min, respectively. Then, the lower part semiconductor layer 104 comprised of the AlN layer 102, the buffer layer 103 and the p-GaN is epitaxially grown on the substrate 101 one by one to be at a growth temperature of 1,050° C. As a doping source of p-type corresponding to the lower part semiconductor layer 104, biscyclopentadienylmagnesium (Cp2Mg) is used. A flow rate of Cp₂Mg is controlled such that a concentration of Mg becomes approximately 1×10¹⁷ cm⁻³. Next, TMGa and NH₃ are introduced at a flow rate of 19 μmol/min and 12 l/min, respectively. The carrier drifting layer 105 a comprised of an undope GaN is epitaxially grown on the lower part semiconductor layer 104 at a growth temperature of 1,050° C. Then, TMAl, TMGa and NH₃ are introduced at a flow rate of as 125 μmol/min, 19 μmol/min, and 12 l/min, respectively. Then, the carrier supplying layer 105 b comprised of n-AlGaN having an Al composition of 25% is epitaxially grown on the carrier drifting layer 105 a, thereby forming the semiconductor operating layer 105. SiH₄ is used as a doping source of n type for the carrier supplying layer 105 b.

In the above description, the buffer layer 103 is formed of approximately eight layers of a GaN/AlN composite lamination having a thickness of 200/20 nm. The thicknesses of the AlN layer 102, the lower part semiconductor layer 104, the carrier drifting layer 105 a, and the carrier supplying layer 105 b are 100 nm, 500 nm, 100 nm, and 20 nm, respectively.

Next, as shown in FIG. 2B, using a plasma chemical vapor deposition (PCVD) method, a mask layer 110 comprised of amorphous silicon (a-Si) is formed on the carrier supplying layer 105 b to have a thickness of 500 nm. A patterning is performed using photolithography and a CF₄ gas to form an open part 110 a.

Next, the recess part 105 c is formed by etching and removing a part of the carrier drifting layer 105 a and the carrier supplying layer 105 b with the mask 110 as a mask using a Cl₂ gas as an etching gas. The Cl₂ gas etches not only the surface of the carrier supplying layer 105 b exposed inside the open part 110 a, but also a side wall 110 b of the open part 110 a, so that the side wall 110 b recedes little by little.

As the side wall 110 b is receding, a fresh surface of the carrier supplying layer 105 b is exposed step by step. The fresh surface thus exposed of the carrier supplying layer 105 b has a large etching depth at a part exposed at an earlier stage due to a longer period of time, and has a small etching depth at a part exposed at a later stage due to a shorter period of time. The side wall 110 b receds continuously, so that the etching depth of the carrier supplying layer 105 b and of the carrier drifting layer 105 a change continuously as well. Thus, an etched surface formed by etching the fresh surface thus exposed is inclined. On the contrary, the surface of the carrier supplying layer 105 b exposed from the beginning at the open part 110 a is etched to have an approximately flat depth. When the lower part semiconductor layer 104 is etched to a depth reaching approximately 120 nm, the recess part 105 c is formed as shown in FIG. 2D. The recess part 105 c has a shape having the side walls 105 d and 105 e standing up from the top surface 104 a with inclining at the angle θ1 and the angle θ2 respectively, and the flat top surface 104 a of the lower part semiconductor layer 104 as a bottom face.

The angle θ1 and the angle θ2 of the side wall 105 d and the 105 e standing up relative to the top surface 104 a are determined by a ratio of etching rates of the semiconductor operating layer 105 and for the mask layer 110. As described above, when the semiconductor operating layer 105 is formed of the GaN base material, the etching gas is the Cl₂ gas, and the mask layer 110 is comprised of a-Si, the angle θ1 and the angle θ2 are approximately 65 degrees. When the mask 110 is formed of a novolac based resist resin of positive type, the angle θ1 and the angle θ2 are approximately 43 degrees. When the etching rate of the mask layer is defined as an a (nm/min) and the etching rate of the semiconductor operating layer is defined as a b (nm/min), an angle θ for the standing up becomes approximately θ=tan⁻¹(b/a).

The mask layer 110 is etched not only from the side wall 110 b at the open part 110 a, but also from the surface thereof. Therefore, the etching is performed until the lower part semiconductor layer 104 is exposed, the mask layer 110 needs to have a sufficient thickness so as not to expose the carrier supplying layer 105 b at a part except the open part 110 a.

Next, as shown in FIG. 2E, the mask layer 110 is removed, and then with the PCVD method using SiH₄ and N₂O as raw material gases, the gate insulating layer 108 comprised of SiO₂ is formed over the top surface of the semiconductor operating layer 105 and the top surface 104 a of the lower part semiconductor layer 104 inside the recess part 105 c to have a thickness of 60 nm. The side wall 105 d and the 105 e are inclined, so that the gate insulating layer 108 has a uniform thickness comparing to a case where the side wall stands up vertically.

Next, as shown in FIG. 2F, a part of the gate insulating layer 108 is removed using hydrofluoric acid, and then the source electrode 106 and the drain electrode 107 are formed on the semiconductor operating layer 105 using a lift-off technology. The source electrode 106 and the drain electrode 107 have a Ti/Al structure with a thickness of 25/300 nm. The metal layer may be formed using a spattering method, a vacuum evaporation method, or the like. After the source electrode 106 and the drain electrode 107 are formed, a process of an annealing is performed for ten minutes at a temperature of 600° C.

Next, using the lift-off technology, the gate electrode 109 with a Ti/Al/Ti structure is formed at the recess part 105 c, thereby completing the MOSFET 100 shown in FIG. 1.

As described above, according to the first embodiment, the MOSFET 100 has the high breakdown voltage.

Example 1, Comparative Example 1

As Example 1-1, 1-2 and Comparative example 1 according to the present invention, each of MOSFETs is produced, that individually has a structure as similar to that of the MOSFET 100 as shown in FIG. 1. Here, the MOSFET regarding Example 1-1 is produced by following the above described process for producing thereof. Moreover, the MOSFET regarding Example 1-2 is produced almost by following the above described process for producing thereof, however, the different point is that the mask layer is formed, which is comprised of the novolac based resist resin of the positive type (the product type of TSM8900 produced by Tokyo Oka Kogyo Co.), and then used for performing the process of the patterning. Further, the MOSFET regarding Comparative example 1 is produced almost by following the above described process for producing thereof, and the different point is that the mask layer is formed with having a thickness as 300 nm, which is comprised of the SiO₂ by using the PCVD method, and then the process of the patterning is performed by using the photolithography and with using a CHF₃ gas. Still further, regarding each of the MOSFETs according to Example 1-1, 1-2 and Comparative example 1, a distance between the gate and the drain is designed to be as 24 μm, as it becomes to be sufficiently longer comparing to the thickness from the substrate for each of the MOSFETs to each of the carrier supplying layers thereon respectively. Still further, an on-resistance and a breakdown voltage thereof are measured for each of the MOSFETs according to Example 1-1, 1-2 and Comparative example 1 respectively. Furthermore, each of angles are measured respectively, for which each of the side walls is standing up at the side of the drain electrode in the semiconductor operating layer at the recess part thereof respectively, by observing a cross section regarding each of the MOSFETs respectively.

FIG. 3 is a chart showing an angle at a standing up thereof, an on-resistance and a breakdown voltage for each of the MOSFETs according to Example 1-1, 1-2 and Comparative example 1 respectively. As shown in FIG. 3, in the case of Comparative example 1, the angle at the standing up is not inclined as it is 90 degrees, because almost all of SiO₂ as the mask layer is not etched by the Cl₂ gas. And, the on-resistance thereof is high as 25 mΩ cm², and the breakdown voltage thereof is low as 300 V. On the contrary, in the case of Example 1-1 and 1-2, the angles at the standing up are 65 degrees and 43 degrees, respectively. The on-resistances thereof are 12 mΩ cm² and 17 mΩ cm², respectively. The breakdown voltages thereof are 650 V and 700 V, respectively, that are approximately similar to the breakdown voltage of 700 V, which is estimated by the laminated structure and the thickness, that are from the substrate via the buffer layer to the carrier supplying layer thereon. That is to say, it becomes able to confirm that there becomes no localized convergence of the electric field occurring at between the gate and the drain regarding the MOSFETs according to Example 1-1 and 1-2.

Second Embodiment

Next, an angle of standing up at a side wall part to be preferred for the FET according to the present invention will be described in detail below. FIG. 4 is an exemplary cross sectional view showing an MOSFET regarding the second embodiment according to the present invention. As shown in FIG. 4, regarding such an MOSFET 200, there are formed a buffer layer 103 by forming with laminating alternately a GaN layer and an AlN layer, a lower part semiconductor layer 104 comprised of p-GaN, and a drift layer 115 comprised of an n-GaN combining with a contact layer, on a substrate 101 comprised of sapphire, SiC, Si, or the like. Moreover, a recess part 105 c is formed at the drift layer 115 by removing a surface thereof to a depth as reaching the lower part semiconductor layer 104. Further, a gate insulating layer 108, which is comprised of SiO₂ or the like, is formed over a top surface of the drift layer 115 and a top surface of the lower part semiconductor layer 104 at an inside of the recess part 115 c. A gate electrode 109 is formed on the gate insulating layer 108 at the recess part 115 c.

Furthermore, regarding the MOSFET 200, a side wall part 115 d at the recess part 115 stands up with inclining as an angle of θ from a top surface 104 a of the lower part semiconductor layer 104.

FIG. 5 is a graph showing a relationship between the angle θ at the standing up and an on-resistance at the side wall part 115 d of the recess part 115 according to the MOSFET 200 as shown in FIG. 4.

As shown in FIG. 4, in a case where the angle of standing up at the side wall part 115 d is 90 degrees, the on-resistance is high, and also it is not able to obtain a sufficient value regarding the maximum current value as 0.21 A/mm. On the contrary, in a case where the angle of standing up is not wider than 75 degrees, the on-resistance becomes to be decreased to approximately one third thereof, and also the maximum current value becomes 3.7 A/mm, which is increased as approximately 1.8 times as that thereof.

On the contrary, in a case where the angle of standing up becomes narrower than 30 degrees, an area of the side wall part 115 d at the recess part 115 becomes relatively larger, and then it causes an increase in an area of a device.

According to the above description, regarding the field effect transistor according to the present invention, it is desirable for the angle of standing up at the side wall part of the recess part to be as not narrower than 30 degrees but not wider than 75 degrees.

Third Embodiment

Next, an MOSFET regarding the third embodiment according to the present invention will be described in detail below. The MOSFET according to the third embodiment has a structure as similar to that of the MOSFET 100 as shown in FIG. 1. However, there is a point different therefrom, that a semiconductor operating layer comprises a contact region directly under a source electrode and a drain electrode.

FIG. 6 is a cross sectional view showing exemplary an MOSFET regarding the third embodiment according to the present invention. Such a MOSFET 300 comprises contact regions 311 and 312 having an electrical conductivity type of an n⁺ type respectively, at directly under a source electrode 106 and a drain electrode 107 respectively, in addition to the configuration as similar to that of the MOSFET 100. And a contact resistivity for the source electrode 106 and for the drain electrode 107 is designed to be as lower. Moreover, the contact region 311 and the 312 are formed from a semiconductor operating layer 105 to a depth as reaching a lower part semiconductor layer 104, however, it is able to set the formed depth properly.

Further, it is able to form the contact layer 311 and the 312 by providing an open part at a predetermined part thereof respectively, and then by introducing Si, Ge, Sn, or the like, as an impurity of n type, by using such as an ion implantation method, a diffusion method, or the like. Furthermore, it may be also able to remove a region beforehand for forming the contact layer 311 and the 312, and then to form a layer having a desired impurity concentration by using a process for a selective re-growth thereof as well.

As described above, the MOSFET 300 according to the third embodiment has the high breakdown voltage and the contract resistivity for the source electrode and for the drain electrode as lower.

Example 2, Comparative Example 2

As Example 2-1, 2-2 and Comparative example 2 according to the present invention, each of MOSFETs is produced with forming the contact layer 311 and the 312 by using the ion implantation method, that individually has a structure as similar to that of the MOSFET 300 as shown in FIG. 6. Here, regarding the MOSFET according to Example 2-1, a patterning for a recess part thereof is performed with using a mask layer comprised of a-Si as similar to that according to Example 1-1. Moreover, regarding the MOSFET according to Example 2-2, a mask layer is formed, which is comprised of a resist resin of the positive type as similar to that according to Example 1-2, and then a patterning for a recess part thereof is performed therewith. Further, regarding the MOSFET according to Comparative example 2, a mask layer is formed, which is comprised of SiO₂ as similar to that according to Comparative example 1, and then a patterning for a recess part thereof is performed therewith. Still further, regarding each of the MOSFETs according to Example 2-1, 2-2 and Comparative example 2, a distance between the gate and the drain is designed to be as 24 μm, as it becomes to be sufficiently longer comparing to the thickness from the substrate for each of the MOSFETs to the carrier supplying layer thereon respectively. Still further, an on-resistance and a breakdown voltage are measured for each of the MOSFETs according to Example 2-1, 2-2 and Comparative example 2 respectively. Furthermore, each of angles are measured respectively, for which each of the side walls is standing up at the side of the drain electrode in the semiconductor operating layer at the recess part thereof respectively.

FIG. 7 is a chart showing an angle at a standing up thereof, an on-resistance and a breakdown voltage for each of the MOSFETs according to Example 2-1, 2-2 and Comparative example 2 respectively. As shown in FIG. 7, in the case of Comparative example 2, the on-resistance is high as 24 mΩ cm², and the breakdown voltage is low as 295 V. On the contrary, in the case of Example 2-1 and 2-2, each of the on-resistances is lower as 12 mΩ·cm² and 18 mΩ cm² respectively. Moreover, each of the breakdown voltages is higher as 638 V and 694 V respectively. That is to say, it becomes able to confirm that there becomes no localized convergence of the electric field occurring at between the gate and the drain regarding the MOSFETs according to Example 2-1 and 2-2.

Fourth Embodiment

Next, an MOSFET regarding the fourth embodiment according to the present invention will be described in detail below. The MOSFET according to the fourth embodiment is a MOSFET having a vertical structure.

FIG. 8 is a cross sectional view showing exemplary an MOSFET regarding the fourth embodiment according to the present invention. Regarding such an MOSFET 400, there is formed a drift layer 404 as a lower part semiconductor layer, which is comprised of n⁻-GaN and has a carrier density as lower, on a substrate 401 comprised of an n-GaN. Moreover, a semiconductor operating layer 405 is formed at a region for a part of the drift layer 404. Further, regarding the semiconductor operating layer 405, a carrier drifting layer 405 a comprised of a p-GaN and a carrier supplying layer 405 b comprised of an n⁺-layer 405 b are laminated one by one. Still further, regarding the semiconductor operating layer 405, a side wall part 405 d is formed for standing up with inclining from a surface 404 a of the drift layer 404. Still further, on the semiconductor operating layer 405, a source electrode 406 is formed for connecting to both of the carrier drifting layer 405 a and the carrier supplying layer 405 b. And then a contact resistivity for the source electrode 406 becomes to be lower, because the carrier supplying layer 405 b carries out a function as a contact layer due to the electrical conductivity type thereof as the n⁺ type. Still further, a drain electrode 407 is formed at a rear surface of the substrate 401. Still further, a gate insulating layer 408, which is comprised of SiO₂ or the like, is formed over a surface of the semiconductor operating layer 405, the inclined side wall 405 d and the surface 404 a of the drift layer 404. Furthermore, a gate electrode 409 is formed on the gate insulating layer 408 for surrounding the side wall part 405 d.

Regarding the MOSFET 400, a channel is formed along the side wall part 405 d regarding the carrier drifting layer 405 a. And then because the side wall part 405 d stands up with inclining as an angle θ5 from the surface 404 a of the drift layer 404, a localized convergence of an electric field becomes to be relaxed at between the gate and the drain, that is different from a case where a side wall stands up vertically from a surface of a drift layer. As a result, it becomes able to realize the MOSFET having the property of the breakdown voltage as higher.

A process for producing the MOSFET 400 will be described next. FIGS. 9A to 9D are explanatory views explaining one example of a process for producing the MOSFET 400.

First, the substrate 401 comprised of n-GaN is set to an MOCVD device. Next, with using the hydrogen gas of the concentration as 100% for a carrier gas, TMGa and NH₃ are introduced thereinto with a rate of flow as 58 μmol/min and 12 l/min, respectively. And then the drift layer 404, the carrier drifting layer 405 a and the carrier supplying layer 405 b are epitaxially grown as one by one on the substrate 401, with a growth temperature as 1,050° C. Moreover, as a doping source of p type corresponding to the carrier drifting layer 405 a, Cp₂Mg is used, and then a rate of flow for Cp₂Mg is controlled for a concentration of the Mg therein to be approximately 1×10¹⁷ cm⁻³. Further, the SiH₄ is used as a doping source of n type corresponding to the drift layer 404 and to the carrier supplying layer 405 b. And then a flow rate of SiH₄ is controlled for a concentration of the Si to be approximately 5×10¹⁶ cm⁻³ in the drift layer 404 and to be approximately 5×10¹⁸ cm⁻³ in the carrier supplying layer 405 b respectively. Furthermore, each of the thicknesses regarding the drift layer 404, the carrier drifting layer 405 a and the carrier supplying layer 405 b is designed to be as 10 μm, 500 nm and 100 nm, respectively.

Next, as shown in FIG. 9A, by using the PCVD method, an a-Si layer is formed with a thickness as 500 nm on the carrier supplying layer 405 b. Moreover, a process of a patterning is performed by using the photolithography and with using the CF₄ gas, and then a mask layer 410 is formed at a region for a part on the carrier supplying layer 405 b.

Next, the carrier drifting layer 405 a and the carrier supplying layer 405 b are etched and removed to a depth as reaching the drift layer 404, with using the mask layer 410 as a mask, and using the Cl₂ gas therewith. In the case thereof, a side wall of the mask layer 410 is etched as well, as similar to the first and the second embodiments. As a result, as shown in FIG. 9B, the surface 404 a of the drift layer 404 becomes to be exposed, and then for the semiconductor operating layer 405, the side wall part 405 d becomes to have a shape as standing up with inclining as the angle θ5 from the surface 404 a.

Next, as shown in FIG. 9C, the mask layer 410 is removed, and then the gate insulating layer 408 comprised of SiO₂ is formed with to be a thickness thereof as 60 nm over the top surface of the semiconductor operating layer 405, the inclined side wall part 405 b and the top surface 404 a of the drift layer 404 by using the PCVD method. Here, because the side wall 405 d is inclined, it becomes able to form the gate insulating layer 408 with the thickness as further uniformly.

Next, as shown in FIG. 9D, a part of the gate insulating layer 408 is removed by using the hydrofluoric acid, and then a part of the carrier supplying layer 405 b is removed as well. Moreover, the source electrode 406 is formed by using the lift-off technology, and the drain electrode 407 is formed over a rear surface of the substrate 401 as well. Here, the source electrode 406 and the drain electrode 407 are designed to be as the Ti/Al structure with a thickness 25/300 nm for each thereof. Further, it is able to perform a layer formation for the metal layer by using the spattering method, the vacuum evaporation method, or the like. Still further, after forming the source electrode 406 and the drain electrode 407, a process of the annealing is performed for ten minutes at a temperature of 600° C. approximately. Furthermore, by using the lift-off technology, the gate electrode 409 is formed with having a Ti/Au/Ti structure for surrounding the side wall 405 d, and then the MOSFET 400 is completed as shown in FIG. 8.

As described above, the MOSFET 400 according to the fourth embodiment becomes to be the MOSFET of the vertical type having the property of the breakdown voltage as higher.

Example 3, Comparative Example 3

As Example 3-1, 3-2 and Comparative example 3 according to the present invention, each of MOSFETs is produced, that individually has a structure as similar to that of the MOSFET 400 as shown in FIG. 8. Here, regarding the MOSFET according to Example 3-1 is produced by following the above described process for producing thereof. Moreover, regarding the MOSFET according to Example 3-2, a mask layer is formed, which is comprised of a resist resin of the positive type as similar to that according to Example 1-2, and then a patterning for a recess part thereof is performed therewith. Further, regarding the MOSFET according to Comparative example 3, the point is different therefrom that a mask layer is formed, which is comprised of SiO₂ as similar to that according to Comparative example 1, and then a patterning for a recess part thereof is performed therewith. Still further, an on-resistance and a breakdown voltage thereof are measured for each of the MOSFETs according to Example 3-1, 3-2 and Comparative example 3 respectively. Furthermore, each of angles are measured respectively, for which each of the side walls is standing up regarding each of inclining formation layers respectively.

FIG. 10 is a chart showing an angle at a standing up thereof, an on-resistance and a breakdown voltage for each of the MOSFETs according to Example 3-1, 3-2 and Comparative example 3 respectively. As shown in FIG. 10, in the case of Comparative example 3, the on-resistance is high as 16 mΩ cm², and the breakdown voltage is low as 200 V. On the contrary, in the case of Example 3-1 and 3-2, each of the on-resistances is lower as 5 mΩ cm² and 9 mΩ cm² respectively. Moreover, each of the breakdown voltages is higher as 530 V and 550 V respectively, that are the values as approximately similar to the value of the breakdown voltage as 600 V, which is estimated with using the thickness of the drift layer. That is to say, it becomes able to confirm that there becomes no localized convergence of the electric field occurring at between the gate and the drain regarding the MOSFETs according to Example 3-1 and 3-2.

Here, according to the above described first and the second embodiment, regarding the side wall of the semiconductor operating layer, the angle corresponding to the surface of the lower part semiconductor layer is similar in both directions thereof. However, an angle may be different between for example, for a part at a carrier drifting layer and for a part at a carrier supplying layer. Moreover, it may be not a straight shape but be curved as well. Ditto regarding the carrier drifting layer and the carrier supplying layer according to the third embodiment. Furthermore, according to the above described third embodiment, the MOSFET is the n type in which the carrier is an electron, however, the present invention is not limited thereto, and it is able to apply to an MOSFET of p type as well.

Although the invention has been described with respect to specific embodiments for a complete and clear disclosure, appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth. 

1. A field effect transistor comprising: a substrate; a semiconductor operating layer having a recess part and formed on the substrate; an insulating layer formed on the semiconductor operating layer including the recess part; a gate electrode formed on the insulating layer at the recess part; and a source electrode and a drain electrode formed on the semiconductor operating layer with the recess part in between and electrically connected to the semiconductor operating layer, wherein said recess part includes a side wall protruding and inclined relative to the semiconductor operating layer.
 2. The field effect transistor according to claim 1, wherein said semiconductor operating layer includes a lower part semiconductor layer having an electrical conductivity type of a p type, a carrier drifting layer with un-doped formed on the lower part semiconductor layer, and a carrier supplying layer having a band gap energy larger than that of the carrier drifting layer, said recess part being formed by removing a part of the carrier drifting layer and the carrier supplying layer to a depth reaching the lower part semiconductor layer.
 3. The field effect transistor according to claim 1, wherein said semiconductor operating layer includes a contact region at a part contacting with the source electrode and the drain electrode.
 4. The field effect transistor according to claim 1, wherein said side wall has an angle of standing up greater than 30 degrees and smaller than 75 degrees.
 5. The field effect transistor according to claim 4, wherein said side wall has the angle of standing up smaller than 65 degrees.
 6. A field effect transistor comprising: a substrate having an electrical conductivity type of an n type or a p type; a lower part semiconductor layer formed on the substrate, said lower part semiconductor layer having an electrical conductivity type the same as that of the substrate and a carrier density lower than that of the substrate; a semiconductor operating layer formed on the lower part semiconductor layer, said semiconductor operating layer including a side wall protruding from the lower part semiconductor layer in an inclined state, a carrier drifting layer having an electrical conductivity type opposite to that of the lower part semiconductor layer, and a carrier supplying layer having an electrical conductivity type the same as that of the lower part semiconductor layer; a source electrode formed on the semiconductor operating layer for connecting to the carrier drifting layer and the carrier supplying layer; a drain electrode formed on a rear surface of the substrate; a gate insulating layer formed over an upper portion of the semiconductor operating layer, the side wall, and an upper portion of the lower part semiconductor layer; and a gate electrode formed on the gate insulating layer for covering the side wall.
 7. The field effect transistor according to claim 6, wherein said side wall has an angle of standing up greater than 30 degrees and smaller than 75 degrees.
 8. The field effect transistor according to claim 7, wherein said side wall has the angle of standing up smaller than 65 degrees.
 9. A method for manufacturing a field effect transistor formed of a nitride based compound semiconductor, comprising the steps of: forming a semiconductor operating layer on a substrate; forming a recess part at a part of the semiconductor operating layer, said recess part including a side wall inclined relative to the semiconductor operating layer; forming a source electrode and a drain electrode on the semiconductor operating layer with the recess part in between for electrically connecting to the semiconductor operating layer; forming an insulating layer on the semiconductor operating layer including the recess part; and forming a gate electrode on the insulating layer at the recess part.
 10. A process for producing a field effect transistor formed of a nitride based compound semiconductor, comprising the steps of: forming a lower part semiconductor layer on a substrate having an electrical conductivity type of an n type or a p type, said lower part semiconductor layer having an electrical conductivity type the same as that of the substrate and a carrier density lower than that of the substrate; laminating sequentially a carrier drifting layer having an electrical conductivity type opposite to that of the lower part semiconductor layer and a carrier supplying layer having an electrical conductivity type the same as that of the lower part semiconductor layer; removing a part of the semiconductor operating layer to form a recess part including a side wall inclined relative to the semiconductor operating layer; forming a source electrode on the semiconductor operating layer for connecting to the carrier drifting layer and the carrier supplying layer; forming a drain electrode on a rear surface of the substrate; forming a insulating layer over the semiconductor operating layer, the side wall, and the lower part semiconductor layer; and forming a gate electrode on the gate insulating layer for covering the side wall. 